Raise3D Pro3

• Number of extruders: 2
• Nozzle size (XY Resolution): 0.4mm (Default) – 0.2/0.6/0.8/1.0 mm available
• Layer Height (Z Resolution): 0.01-0.25 mm
• Build Volume:
  • Single Extruder Print: 300 x 300 x 300 mm
  • Dual Extruder Print: 255 x 300 x 300 mm
• Mechanical resolution: XY: 0.78 µm, Z: 0.078 µm

Allowed Materials

• PLA/ ABS/ HIPS/ PC/ TPU/ TPE/ PETG/ ASA/ PP/ PVA/ Nylon/Glass Fiber Infused/ Carbon Fiber Infused/ Metal Fill/ Wood Fill
  • Official filaments
  • Third party certified filaments
    • Filament diameter: 1.75 mm
    • Max Nozzle temperature: 300 ºC
    • Max Build Plate Temperature: 120 ºC

Useful Info

• User Manual: Web, PDF
• Slicing software: Ideamaker (How to use it)
• How to load/unload filament: Procedure
• Tested Printing Profiles (Select Printer Model: Raise3D Pro3 Series on left column)

FormLabs Form3B

• Laser Spot Size (XY Resolution): 85 µm
• Layer Height (Z Resolution): 25/50/100 µm
• Build Volume (XYZ): 145 x 145 x 185

Materials Allowed

• FormLabs proprietary resins, including biocompatible and autoclavable ones.
• Materials solvent compatibility

Useful Info

• Printer User Manual: PDF
• Design:
  • Design Specification for Form3B
  • Slicing software: PreForm
• Post-Processing:
  • Form Wash Manuals: Manual, Quick Start, Safety Booklet
  • Form Cure Manuals: Manual, Quick Start, Safety Booklet
  • Settings for Wash (Updated 21/01/2022) & Cure (updated 14/03/2022); for most recent changes check the full articles, respectively here and here.

Epilog Mini 18 40W

• Laser Source: 40 Watt CO2, air-cooled, 1062um
• Max cutting area: 457 x 305 mm (18″ x 12″)
• Max cutting depth: 6 mm (PMMA)
• Max Material thickness: 10 cm (15 cm if area smaller than 44 x 25 cm)
• 2″ (51 mm) Focus lens
• Laser spot diameter: 100-180 µm

Materials allowed

• PMMA
• non-chlorine rubber

Other materials might be possible, but it is mandatory to check with staff first.

Useful Info

• User Manual: PDF
• Suggested Design Software: Adobe Illustrator, Inkscape

StepCraft M500

• HF Precision Milling Spindle: 25 krpm, 500W motor
• XYZ working space: 348 x 543 x 194 mm
• XY Clamping surface: 513 x 600 mm

Materials Allowed

• Plastics: Thermoplastics, ABS, PE, PP, soft / hard PVC, Lexan®, polyamid, Plexiglas®
• Elastomers, thermosets
• Soft non-ferrous metals

Useful Info

• Suggested Design Software: Autodesk Inventor, Solidworks

Laurell WS-650-23B

• Maximum substrate size: 5” (127 mm) diameter
• Maximum rotational speed (12 krpm for 100 mm wafer)

Harrick PDC-002

• Chamber size: 150 x 165 mm
• Maximum RF Power: 45 W
• Gas: Air

Heratherm Advanced protocol drying oven

• Gravity convection
• Internal volume: 61 L
• Max temperature: 330 ºC

Laurell WS-650-23B

• Maximum substrate size: 5” (127 mm) diameter
• Maximum rotational speed (12 krpm for 100 mm wafer)

Torrey Pines HP40A

• Milled Flat Cast Aluminum Top (203 x 203 mm)
• Fully programmable memory (10 programs)
• Heater resolution: 1°C
• Temperature accuracy: 1% of setting
• Temperature ramping

Leica S9i

• Magnification: 6.1x – 55x
• FOV: 37.6 mm
• Working Distance: 122 mm
• Integrated camera resolution: 250 lp/mm

Sensofar S-Neox

• Technologies: Confocal, Interferometry and Active Illumination Focus Variation
• Objectives: 5X EPI, 20X EPI, 50X ELWD, 50X DI
• XY Range: 114 x 75 mm
• Z Range: Coarse: 40 mm; Fine: 200 µm
• Z resolution: Coarse: 5 nm; Fine: 1.25 nm
• Auto Tip-Tilt, Auto-stitching

• Digital Oscilloscope (4 channels, 100MHz, 8Gsa/s)
• Bench Adjustable Power supply (0-30V, 0-3A)
• Function generator (1 Channel, 3 MHz)
• Regulable soldering station
• Arduino prototyping platform, general purpose electronics components
• Manual tools
• Power tools (Cordless drill/driver, Dremel)